Prof. QuanXue, IEEE Fellow
School of Electronic and Information Engineering/School of Microelectronics,South China University of Technology, China
Prof. XUE's research interests include microwave/millimeter-wave/THz passive components, active components, antenna, microwave monolithic integrated circuits (MMIC, and radio frequency integrated circuits (RFIC), etc. In 1993, he joined the UESTC as a Lecturer. He became a Professor in 1997. From October 1997 to October 1998, he was a Research Associate and then a Research Fellow with the Chinese University of Hong Kong. In 1999, he joined the City University of Hong Kong and was a Chair Professor of Microwave Engineering. He also served the University as the Associate Vice President, the Director of Information and Communication Technology Center, and the Deputy Director of the State Key Lab of Millimeter Waves (Hong Kong). In 2017, he joined the South China University of Technology. Now he is a Professor and serves as the dean of the School of Electronics and Information Engineering, the dean of the School of Microelectronics, the Director of the Guangdong Key Laboratory of Terahertz and Millimeter Waves. He also serves as the Chief scientist of Huawei Technologies 2012 Labs, a National 6G Technology General Expert Group member. He has published over 500 internationally refereed journal papers and over 200 international conference papers.
Title:Millimeter-wave Transceiver Chips with Antenna in Package
The increasing high requirements of wireless communications and sensors are making research and commercialization of millimeter-wave integrated circuits and antennas experience tremendous growth. The advancement of modern CMOS technology facilitates it to become the prevailing technology to achieve low-cost and highly-integrated millimeter-wave integrated circuits. Meanwhile, the compound semiconductor is still a must for low noise and high power millimeter-wave system. As the operating frequency enters the millimeter-wave regime, the circuit component's size becomes comparable to the electromagnetic wave wavelength. Therefore, a mixed design methodology using both the lumped and distributed elements in the millimeter-wave integrated circuit design is of great interest, not only compound semiconductor but also CMOS integrated circuits. On one hand, to achieve high-integration and high-pwerformance, the heterogeneous packaging architecture to combined the merits of both CMOS and compound semiconductor millimeter-wave integrated circits is becoming an attractive technology. On the other hand, considering the efficiency, cost, and integration of advanced wireless systems, discrete antenna is no longer suitable for millimeter-wave wireless systems. Therefore, antenna-in-package (AiP) has become the mainstream for millimeter-wave system, which implements an antenna or antennas on (or in) package of chips leading to a high efficiency and highly-integrated radio. In the talk, innovative design approaches and methodologies on millimeter-wave integrated circuits，subsystems and corresponding antenna-in-package will be introduced.
Prof. Wenjie Feng
Feng Wenjie: male, professor of South China University of Technology, winner of National Natural Science Fund for Distinguished Young Scholars in 2018. The main research area is microwave / millimeter-wave circuits and devices.
He won the Second Prize of Science and Technology of Jiangsu Province in 2015, and the Second Prize of Science and Technology Progress Award of China Electronics Society in 2021.
Speech Title：Research on Millimeter-wave Circuits Based on Gap Waveguide (GWG)
Abstract：In this work, the microstrip transitions are introduced here for system integration between the antenna and the passive/active components. The theory background and the evolution of gap waveguide proposed by Prof. P. S. Kildal, are also described simply. Finally, the future development of the gap waveguide based on the Micro-Electromechanical System (MEMS) technology is discussed. This overview work aims to provide a solution for the millimeter-wave circuits, especially in the W-band.
Xiangtan University, China
Ouyang Jianquan, Ph.D., Second-level professor of Hunan Province, doctoral supervisor, visiting scholar at the University of Georgia, U.S.A. He was selected as the third-level candidate of Hunan Province New Century 121 Talent Project in 2011. He was selected as the 2019-2020 Hunan Province "Three Districts" Talent Support Program. He was awarded the China Industry-University-Research Cooperation Promotion Award in 2019. He was awarded the Baosteel Education Award and the first outstanding science and technology worker in Xiangtan City in 2018. He was awarded the third prize of Hunan Province Natural Science in 2010. He was awarded the second prize of Hunan Province Teaching Achievement in 2013 and the second prize in 2016 and 2019. In 2014, he won the third prize of excellent achievements in educational scientific research in Hunan Province. In 2018, he won the national prize of teaching innovation in artificial intelligence and big data education in colleges and universities. In 2020, 2021 and 2022, he won the "Outstanding Contribution Award" for Artificial Intelligence Big Data Blockchain Education in National Universities. In 2007, he was selected as the training object of young backbone teachers in general colleges and universities in Hunan Province. He is a senior member of China Computer Federation (CCF) and a liaison of Xiangtan University, a correspondent member of CCF Youth Working Committee, a member of CCF Education Working Committee, a correspondent member of CCF Big Data Expert Committee, a standing member of CCF Computer Application Professional Committee, a member of CCF Computer Vision Professional Committee, a member of CCF Pervasive Computing Professional Committee, a member of YOCSEF ( Young Computer Science and Technology Forum of Chinese Computer Society) Changsha Sub-Forum 2015-2016 Chair, Executive Member of CCF Changsha Member Center, Senior Member of Chinese Society of Artificial Intelligence.
Speech Title：PCP-RC-LM:single-sequence-based protein contact prediction using dual graph convolutional neural network and convolutional neural network
Senior engineerShiling Zhang
State Grid Chongqing Electric Power Company Chongqing Electric Power Research Institute, China
Zhang Shiling, Senior engineer, Doctor of Engineering, is currently the director of Science and Technology management, physical and chemical testing technology, Electric Power Research Institute of State Grid Chongqing Electric Power Company. Long engaged in high voltage and insulation technology, physical and chemical testing technology research and production work. He is a full-time key researcher of State Grid Provincial Laboratory of Chongqing Electric Power Company and Key Provincial and ministerial Laboratory of Chongqing, member of IEEE Sub-Committee on New Sensing and Monitoring Technology, member of Insulation Materials and Insulation Technology Professional Committee of Chinese Society of Electrotechnical Engineering, member of high voltage Sub-committee of Chinese Society of Electrical Engineering. The development of UHV dry converter transformer bushing and SF6 gas insulation through-wall bushing have been applied to the construction of UHV AC/DC engineering. Presided over the completion of GIS fault detection sensor technology and system, won the Outstanding Innovation Achievement Award of the International Innovation and Entrepreneurship Expo, and awarded the title of Outstanding Scientist by Chongqing Society of Electrical Engineering.
As the first author, he has published more than 90 SCI/EI retrieval papers in domestic and foreign journals and international top academic conferences, and 18 Chinese core journals of Peking University. His innovation achievements have won 9 provincial and ministerial awards, such as the first prize of Chongqing Science and Technology Progress Award and the special first prize of China Water Conservancy and Electric Power Quality Management Association, and accepted 1 international invention patent. He has authorized 20 national invention patents and utility models, 18 software Copyrights, more than 20 international and domestic conference reports, and presided over 2 provincial and ministerial projects of basic frontier and 3 science and technology projects of the headquarters of State Grid Corporation as the project leader.
Title: Establishment of three-dimensional digital twin model of UHV converter transformer equipment based on image data processing and optimization design of its accessory structure
Abstract：Taking the converter transformer for UHV converter valve hall as the research object, this special speech discusses the construction process of its three-dimensional digital model from the insulation structure of the transformer body. Further, focusing on the outgoing device and bushing structure of converter transformer, this paper introduces the typical structure, the actual valve hall operation environment and the heating theoretical model of high-voltage power equipment under high harmonic load from the perspective of high-voltage power equipment operation, analyzes the electro-thermal coupling nonlinear electric field of transformer outgoing device, and optimizes its insulation structure by using RBF neural network and NSGA-II multi-objective optimization algorithm.
Considering the complex structure of converter transformer and its outgoing line device and converter bushing area are important typical accessories, this paper focuses on the construction of digital twin 3D model in this area, and carries out on-site operation and maintenance simulation test and high current Functional response analysis under high voltage load. The digital twin model of the outlet device area is constructed according to the electro-thermal coupling physical field simulation model. The electro-thermal sensor is used to monitor the on-line voltage and current waveform in real time, and the interaction between the on-site operating parameters and the loading data of the digital twin model is realized. On the other hand, the intelligent extraction and identification of material area in the digital twin model is realized, and the material parameter performance can be changed according to the physical field environment, so as to adapt to the structural design and performance evaluation of different operating environments. Furthermore, in order to analyze the relationship between the internal transient temperature of the converter bushing and its short-time current carrying capacity and long-term aging performance, an evaluation process method of the long-term internal insulation performance of the high-voltage bushing is proposed.
Focuses on the 3D construction of digital twin model in the outgoing area of converter transformer. Its research method can be extended to key components such as converter body winding structure, oil paper insulation area and on load switch. The research results of this paper can provide theoretical guidance and technical reference for the insulation structure design of converter transformer body, especially for the structural design and operation maintenance of outlet device area, and can provide some theoretical guidance for on-line analysis of short-term current carrying capacity and long-term aging performance of converter transformer outlet device area.